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    Author information
    First name: Xian Tong
    Last name: Chen
    DBLP: 21/5844
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    Conference paper
    A. D. Trigg, Tai Chong Chai, Xiaowu Zhang, Xian Tong Chen, Leong Ching Wai.
    Modular sensor chip design for package stress evaluation and reliability characterisation.
    Microelectronics Reliability 2012, Volume 52 (0) 2012
    Conference paper
    Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen.
    Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
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