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    Author information
    First name: Kok Tong
    Last name: Tan
    DBLP: 30/1065
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    Conference paper
    Cher Ming Tan, Wei Li, Kok Tong Tan, Frankie Low.
    Development of highly accelerated electromigration test.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    Cher Ming Tan, Arijit Roy, Kok Tong Tan, Derek Sim Kwang Ye, Frankie Low.
    Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Guan Zhang, Cher Ming Tan, Kok Tong Tan, Derek Sim Kwang Ye, W. Y. Zhang.
    Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology.
    Microelectronics Reliability 2004, Volume 44 (0) 2004
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    Your query returned 3 matches in the database.