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    Author information
    First name: Cher Ming
    Last name: Tan
    DBLP: 40/3133
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    Below you find the publications which have been written by this author.

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    Journal article
    Marvin Chan, Cher Ming Tan, Kheng Chooi Lee, Chuan Seng Tan.
    Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation.
    Microelectronics Reliability 2016, Volume 61 (0) 2016
    Conference paper
    A. Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou.
    Editorial.
    Microelectronics Reliability 2016, Volume 61 (0) 2016
    Conference paper
    Preetpal Singh, Cher Ming Tan, Liann-Be Chang.
    Early degradation of high power packaged LEDs under humid conditions and its recovery - Myth of reliability rejuvenation.
    Microelectronics Reliability 2016, Volume 61 (0) 2016
    Conference paper
    Preetpal Singh, Cher Ming Tan.
    A review on the humidity reliability of high power white light LEDs.
    Microelectronics Reliability 2016, Volume 61 (0) 2016
    Conference paper
    Udit Narula, Cher Ming Tan, Chao Sung Lai.
    Copper induced synthesis of graphene using amorphous carbon.
    Microelectronics Reliability 2016, Volume 61 (0) 2016
    Journal article
    Song Lan, Cher Ming Tan, Kevin Wu.
    Methodology of reliability enhancement for high power LED driver.
    Microelectronics Reliability 2014, Volume 54 (0) 2014
    Journal article
    Cher Ming Tan, Wen Zhi Yu.
    Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter.
    Microelectronics Reliability 2014, Volume 54 (0) 2014
    Journal article
    A. Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou.
    Special section reliability and variability of devices for circuits and systems.
    Microelectronics Reliability 2014, Volume 54 (0) 2014
    Journal article
    Xiangchen Chen, Cher Ming Tan.
    Modeling and analysis of gate-all-around silicon nanowire FET.
    Microelectronics Reliability 2014, Volume 54 (0) 2014
    Journal article
    Minh Duc Le, Cher Ming Tan.
    Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspection scheduling.
    Rel. Eng. Sys. Safety 2013, Volume 113 (0) 2013
    Conference paper
    J. Zhang, L. Zhang, Y. Dong, H. Y. Li, Cher Ming Tan, G. Xia, Chuan Seng Tan.
    The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material.
    2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013 2013 (0) 2013
    Journal article
    Feifei He, Cher Ming Tan.
    Electromigration reliability of interconnections in RF low noise amplifier circuit.
    Microelectronics Reliability 2012, Volume 52 (0) 2012
    Conference paper
    Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou.
    ICMAT 2011 - Reliability and variability of semiconductor devices and ICs.
    Microelectronics Reliability 2012, Volume 52 (0) 2012
    Conference paper
    Cher Ming Tan, Wei Li, Zhenghao Gan.
    Applications of finite element methods for reliability study of ULSI interconnections.
    Microelectronics Reliability 2012, Volume 52 (0) 2012
    Conference paper
    Sihan Joseph Chen, Cher Ming Tan, Boon Khai Eric Chen, Zhi Yong Shaun Chua.
    Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test.
    Microelectronics Reliability 2012, Volume 52 (0) 2012
    Conference paper
    Feifei He, Cher Ming Tan.
    Effect of IC layout on the reliability of CMOS amplifiers.
    Microelectronics Reliability 2012, Volume 52 (0) 2012
    Conference paper
    Song Lan, Cher Ming Tan, Kevin Wu.
    Reliability study of LED driver - A case study of black box testing.
    Microelectronics Reliability 2012, Volume 52 (0) 2012
    Journal article
    Feifei He, Cher Ming Tan.
    Circuit level interconnect reliability study using 3D circuit model.
    Microelectronics Reliability 2010, Volume 50 (0) 2010
    Journal article
    Cher Ming Tan, Boon Khai Eric Chen, Kok Peng Toh.
    Humidity study of a-Si PV cell.
    Microelectronics Reliability 2010, Volume 50 (0) 2010
    Journal article
    Feifei He, Cher Ming Tan.
    Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model.
    Microelectronics Reliability 2010, Volume 50 (0) 2010
    Journal article
    Y. C. Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu.
    Electromigration performance of Through Silicon Via (TSV) - A modeling approach.
    Microelectronics Reliability 2010, Volume 50 (0) 2010
    Journal article
    Arijit Roy, Yuejin Hou, Cher Ming Tan.
    Electromigration in width transition copper interconnect.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    Jie Liao, Cher Ming Tan, Geert Spierings.
    Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI).
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    Cher Ming Tan, Boon Khai Eric Chen, Gan Xu, Yuanjie Liu.
    Analysis of humidity effects on the degradation of high-power white LEDs.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    Cher Ming Tan, Nagarajan Raghavan.
    Reply to comments on "A framework to practical predictive maintenance modeling for multi-state systems".
    Rel. Eng. Sys. Safety 2009, Volume 94 (0) 2009
    Journal article
    Cher Ming Tan, Nagarajan Raghavan.
    A framework to practical predictive maintenance modeling for multi-state systems.
    Rel. Eng. Sys. Safety 2008, Volume 93 (0) 2008
    Conference paper
    Guangyu Huang, Cher Ming Tan.
    Reverse Breakdown Voltage Measurement for Power P
    J. Electronic Testing 2008, Volume 24 (0) 2008
    Conference paper
    Wei Li, Cher Ming Tan.
    Enhanced finite element modelling of Cu electromigration using ANSYS and matlab.
    Microelectronics Reliability 2007, Volume 47 (0) 2007
    Conference paper
    Cher Ming Tan, Nagarajan Raghavan.
    An approach to statistical analysis of gate oxide breakdown mechanisms.
    Microelectronics Reliability 2007, Volume 47 (0) 2007
    Conference paper
    Cher Ming Tan, Stanny Yanuar, Tai Chong Chai.
    Finite element modeling of capacitive coupling voltage contrast.
    Microelectronics Reliability 2007, Volume 47 (0) 2007
    Conference paper
    Arijit Roy, Cher Ming Tan, Sean J. O'Shea, Kedar Hippalgaonkar, Wulf Hofbauer.
    Room temperature observation of point defect on gold surface using thermovoltage mapping.
    Microelectronics Reliability 2007, Volume 47 (0) 2007
    Conference paper
    Cher Ming Tan, Zhenghao Gan, Tai Chong Chai.
    Feasibility study of the application of voltage contrast to printed circuit board.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    Arijit Roy, Cher Ming Tan.
    Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    Cher Ming Tan, Wei Li, Kok Tong Tan, Frankie Low.
    Development of highly accelerated electromigration test.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    Guangyu Huang, Cher Ming Tan.
    Device level electrical-thermal-stress coupled-field modeling.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen.
    Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Cher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim.
    Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Cher Ming Tan, Arijit Roy, Kok Tong Tan, Derek Sim Kwang Ye, Frankie Low.
    Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Cher Ming Tan, Zhenghao Gan, Wai Fung Ho, Sam Chen, Robert Liu.
    Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Cher Ming Tan, Joe Chiu, Robert Liu, Guan Zhang.
    Reliability screening through electrical testing for press-fit alternator power diode in automotive application.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Guan Zhang, Cher Ming Tan, Kok Tong Tan, Derek Sim Kwang Ye, W. Y. Zhang.
    Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology.
    Microelectronics Reliability 2004, Volume 44 (0) 2004
    Conference paper
    Cher Ming Tan, Kelvin Ngan Chong Yeo.
    A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT).
    J. Electronic Testing 2001, Volume 17 (0) 2001
    Journal article
    Cher Ming Tan, King-Jet Tseng.
    Using power diode models for circuit simulations-a comprehensive review.
    IEEE Transactions on Industrial Electronics 1999, Volume 46 (0) 1999
    Show item 1 to 43 of 43  

    Your query returned 43 matches in the database.