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Electromigration in width transition copper interconnect.

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    Publication properties
    Title: Electromigration in width transition copper interconnect.
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    Date: 2009
    Publication type: Journal article
    Authors:
    No. First name Last name Show
    1. Arijit Roy
    2. Yuejin Hou
    3. Cher Ming Tan
    Download (by DOI): 10.1016/j.microrel.2009.06.038
    BibTeX: journals/mr/RoyHT09
    DBLP: db/journals/mr/mr49.html#RoyHT09
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    Journal
    Name: Microelectronics Reliability
    Year: 2009
    Volume: 49
    Number: 3
    DBLP: db/journals/mr/mr49.html