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Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect.

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    Publication properties
    Title: Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect.
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    Date: 2006
    Publication type: Conference paper
    Authors:
    No. First name Last name Show
    1. Arijit Roy
    2. Cher Ming Tan
    Download (by DOI): 10.1016/j.microrel.2006.07.036
    BibTeX: journals/mr/RoyT06
    DBLP: db/journals/mr/mr46.html#RoyT06
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    Journal
    Name: Microelectronics Reliability
    Year: 2006
    Volume: 46
    Number: 5
    DBLP: db/journals/mr/mr46.html