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Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures.

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    Publication properties
    Title: Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures.
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    Date: 2005
    Publication type: Conference paper
    Authors:
    No. First name Last name Show
    1. Arijit Roy
    2. Cher Ming Tan
    3. Rakesh Kumar
    4. Xian Tong Chen
    Download (by DOI): 10.1016/j.microrel.2005.07.042
    BibTeX: journals/mr/RoyTKC05
    DBLP: db/journals/mr/mr45.html#RoyTKC05
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    Journal
    Name: Microelectronics Reliability
    Year: 2005
    Volume: 45
    Number: 12
    DBLP: db/journals/mr/mr45.html