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Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects.

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    Publication properties
    Title: Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects.
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    Date: 2005
    Publication type: Conference paper
    Authors:
    No. First name Last name Show
    1. Cher Ming Tan
    2. Arijit Roy
    3. Kok Tong Tan
    4. Derek Sim Kwang Ye
    5. Frankie Low
    Download (by DOI): 10.1016/j.microrel.2005.07.045
    BibTeX: journals/mr/TanRTYL05
    DBLP: db/journals/mr/mr45.html#TanRTYL05
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    Journal
    Name: Microelectronics Reliability
    Year: 2005
    Volume: 45
    Number: 12
    DBLP: db/journals/mr/mr45.html