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    Journal
    Name: Microelectronics Reliability
    Year: 2005
    Volume: 45
    Number: 12
    DBLP: db/journals/mr/mr45.html
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    Below you find the publications assigned to this venue.

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    Conference paper
    Adam Jarosz, Andrzej Pfitzner.
    Evaluation of parasitic capacitances for interconnection buses crossing in different layers.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Milos D. Krstic, Mile K. Stojcev, Goran Lj. Djordjevic, Ivan D. Andrejic.
    A mid-value select voter.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    W. L. Pearn, Mou-Yuan Liao.
    Measuring process capability based on C
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Kris Vanstreels, Marc D'Olieslaeger, Ward De Ceuninck, Jan D'Haen, Karen Maex.
    A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Ernest Y. Wu, Jordi Suñé.
    Power-law voltage acceleration: A key element for ultra-thin gate oxide reliability.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Yi He.
    Chemical and diffusion-controlled curing kinetics of an underfill material.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    R. Rölver, O. Winkler, M. Först, B. Spangenberg, H. Kurz.
    Light emission from Si/SiO
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    J. Pétry, Wilfried Vandervorst, Luigi Pantisano, Robin Degraeve.
    On the data interpretation of the C-AFM measurements in the characterization of thin insulating layers.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Xiaowu Zhang, Ee-Hua Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao.
    Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Conference paper
    Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen.
    Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures.
    Microelectronics Reliability 2005, Volume 45 (0) 2005
    Show item 1 to 10 of 302  

    Your query returned 302 matches in the database.