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    Journal
    Name: Microelectronics Reliability
    Year: 2006
    Volume: 46
    Number: 5
    DBLP: db/journals/mr/mr46.html
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    Below you find the publications assigned to this venue.

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    Conference paper
    Jean Augereau, Yves Ousten, Bruno Levrier, Laurent Béchou.
    Use of signal processing imaging for the study of a 3D package in harsh environment.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    Toru Miyazaki, Tomoya Omata.
    Electromigration degradation mechanism for Pb-free flip-chip micro solder bumps.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    Yasushi Yamada, Yoshikazu Takaku, Yuji Yagi, Y. Nishibe, I. Ohnuma, Y. Sutou, R. Kainuma, K. Ishida.
    Pb-free high temperature solders for power device packaging.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    Shuang Yang, Ji Wu, Aristos Christou.
    Initial stage of silver electrochemical migration degradation.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    S. Y. Yang, W. J. Lee, S. H. Jeong, S. J. Lee.
    Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    F. P. McCluskey, M. Dash, Z. Wang, D. Huff.
    Reliability of high temperature solder alternatives.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    V. Krieger, W. Wondrak, A. Dehbi, W. Bartel, Yves Ousten, Bruno Levrier.
    Defect detection in multilayer ceramic capacitors.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    Yi-Shao Lai.
    On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    Jing Lee.
    A reliability-driven placement procedure based on thermal-force model.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Conference paper
    P. Zimprich, T. Licht, B. Weiss.
    A new method to characterize the thermomechanical response of multilayered structures in power electronics.
    Microelectronics Reliability 2006, Volume 46 (0) 2006
    Show item 1 to 10 of 276  

    Your query returned 276 matches in the database.