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    Journal
    Name: Microelectronics Reliability
    Year: 2009
    Volume: 49
    Number: 3
    DBLP: db/journals/mr/mr49.html
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    Below you find the publications assigned to this venue.

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    Journal article
    Albert T. Wu, Y. C. Ding.
    The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    Mounira Berkani, Stéphane Lefebvre, Narjes Boughrara, Zoubir Khatir, Jean-Claude Faugières, Peter Friedrichs, Ali Haddouche.
    Estimation of SiC JFET temperature during short-circuit operations.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    Ta-Hsuan Lin, Stephen Paul, Susan Lu, Huitian Lu.
    A study on the performance and reliability of magnetostatic actuated RF MEMS switches.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    Huimin Xie, Satoshi Kishimoto, Yanjie Li, Qingjun Liu, Yapu Zhao.
    Fabrication of micro-moiré gratings on a strain sensor structure for deformation analysis with micro-moiré technique.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    Meng Liu, Ai-Ping Xian.
    Tin whisker growth on bulk Sn-Pb eutectic doping with Nd.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    Jianxin Zhu, Rencheng Song.
    Fast and stable computation of optical propagation in micro-waveguides with loss.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    D. M. Tanner.
    MEMS reliability: Where are we now?
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    L. Dupont, Gerard Coquery, K. Kriegel, A. Melkonyan.
    Accelerated active ageing test on SiC JFETs power module with silver joining technology for high temperature application.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    Juan Antonio Maestro, Pedro Reviriego.
    A method to eliminate the event accumulation problem from a memory affected by multiple bit upsets.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Journal article
    Mirko Bernardoni, Paolo Cova, Nicola Delmonte, Roberto Menozzi.
    Heat management for power converters in sealed enclosures: A numerical study.
    Microelectronics Reliability 2009, Volume 49 (0) 2009
    Show item 1 to 10 of 247  

    Your query returned 247 matches in the database.